陶粒对SC-SCC黏结界面劈裂破坏特性的影响
作者:
作者单位:

1.中南大学 土木工程学院,湖南 长沙 410075;2.湖南工学院 材料科学与工程学院,湖南 衡阳 421002;3.江苏科技大学 土木工程学院,江苏 镇江 212028

作者简介:

赵 洪(1988—),男,湖南永州人,中南大学博士生.E-mail:zhaohong165@163.com

通讯作者:

龙广成(1973—),男,江西万载人,中南大学教授,博士生导师,博士.E-mail:565410408@qq.com

中图分类号:

TU528.01

基金项目:

国家重点研发计划资助项目(2021YFF0502100);国家自然科学基金资助项目(11790283);中央高校基本科研业务费专项资助项目(502802002);湖南省应用特色学科材料科学与工程学科建设项目(湘教通〔2022〕351号)


Effect of Ceramsite on Splitting Failure Characteristics of SC-SCC Bonding Interface
Author:
Affiliation:

1.School of Civil Engineering, Central South University, Changsha 410075, China;2.School of Materials Science and Engineering, Hunan Institute of Technology, Hengyang 421002, China;3.School of Civil Engineering, Jiangsu University of Science and Technology, Zhenjiang 212028, China

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    摘要:

    基于劈裂试验,研究了陶粒对蒸养混凝土(SC)-自密实混凝土(SCC)黏结界面力学特性的影响.结果表明:陶粒能提高SC-SCC黏结界面的劈裂抗拉强度,增加黏结界面的张开位移值,提升黏结界面的延性;黏结界面应力-应变曲线可分为线性发展阶段、塑性发展阶段和失效破坏阶段;双参数Weibull分布模型可较好地模拟黏结界面应力-应变曲线的上升段,当黏结界面的陶粒引入量低于4 kg/m2时,黏结界面损伤变量的演化进程被有效减缓.

    Abstract:

    Influence of ceramsite on mechanical properties of bonding interface between steam cured concrete(SC)-self-compacting concrete(SCC) was investigated by splitting test. The results show that addition of ceramsite can improve splitting tensile strength of bonding interface, increase bonding interface opening displacement value and thus significantly increase ductility of bonding interface. Stress-strain curves of bonding interface can be divided into linear development stage, plastic development stage and failure stage. The two-parameter Weibull distribution model can better simulate the rising section of stress-strain curves of bonding interface, and when the amount of ceramsite is less than 4 kg/m2, the evolution process of damage variable can be reduced with increasing ceramsite content.

    表 1 SC和SCC的配合比Table 1 Mix proportions of the SC and SCC Unit:kg/m3
    图1 蒸养制度Fig.1 Steam curing system
    图2 试件制备Fig.2 Specimen preparation
    图3 劈裂抗拉试验装置图Fig.3 Device diagram of splitting tensile test
    图4 破坏断面图Fig.4 Failure surface diagram
    图5 应力-应变曲线范围Fig.5 Scope of stress-strain curves
    图6 劈裂抗拉强度Fig.6 Splitting tensile strength
    图7 黏结界面破坏过程的应变云图Fig.7 Strain contour figures at bonding interface failure process
    图8 L0检查线示意图Fig.8 Schematic diagram of measure line L0
    图9 L0检查线在不同荷载下的位移值分布Fig.9 Distribution of bonding interface opening displacement value of L0 at different loads
    图10 不同黏结界面的试验曲线和模型曲线对比图Fig.10 Comparison of theoretical curves and test curves of different bonding interfaces
    图11 损伤变量D的演化过程Fig.11 Damage variable evolution process
    图12 黏结界面黏结模型示意图Fig.12 Structure model diagram of bonding interface
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引用本文

赵洪,谢友均,龙广成,唐卓,李文旭.陶粒对SC-SCC黏结界面劈裂破坏特性的影响[J].建筑材料学报,2024,27(4):350-358

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  • 收稿日期:2023-05-21
  • 最后修改日期:2023-08-12
  • 在线发布日期: 2024-05-11
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