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引用本文:马子业,汪海年,张炎棣,李元乐,惠冰.碎石封层的集料嵌挤状态与抗剥落性[J].建筑材料学报,2023,26(8):906-913
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碎石封层的集料嵌挤状态与抗剥落性
马子业1,2,汪海年1,2,张炎棣1,李元乐1,惠冰1
1.长安大学 公路学院,陕西 西安 710064;2.长安大学 特殊地区公路工程教育部重点实验室,陕西 西安 710064
摘要:
采用自开发算法和自研发的轮式加速加载磨耗仪,研究了集料形态对碎石封层嵌挤结构与抗剥落性的影响.结果表明:80.7%的针状集料以平铺形式存在,对碎石封层嵌挤结构的影响较小,为保证良好的抗剥落性,其含量不宜高于16%;片状集料多以平铺或交叠形式存在,易引起相邻集料的移位和交叠,对集料嵌入率和保持能力不利,含量应控制在10%以下;当针状与片状集料同时存在时,碎石封层经历磨耗后的质量损失增加约2%;集料嵌入面积百分率兼具良好的稳定性与敏感性,是评价碎石封层抗剥落性的理想指标.
关键词:  碎石封层  集料形态  嵌挤结构  抗剥落性  响应面分析
DOI:10.3969/j.issn.1007-9629.2023.08.011
分类号:U418.6
基金项目:“十四五”国家重点研发计划项目(2021YFB2601000);国家自然科学基金资助项目(52078048);中央高校基本科研业务费专项资金—长安大学优秀博士学位论文培育资助项目(300102212708)
Aggregate Embedding State and Spalling Resistance of Pavement Chip Seal
MA Ziye1,2, WANG Hainian1,2, ZHANG Yandi1, LI Yuanle1, HUI Bing1
1.School of Highway, Chang’an University, Xi’an 710064, China;2.Key Laboratory for Special Area Highway Engineering of Ministry of Education, Chang’an University, Xi’an 710064, China
Abstract:
The effect of aggregate shape on the embedding structure and spalling resistance of chip seals was investigated using self-developed algorithms and a wheeled accelerated loading wear tester. The results show that 80.7% of elongated aggregates are distributed tiled, whose negative effect on the aggregate embedding is insignificant. To ensure good spalling resistance, the content of elongated aggregate should not be higher than 16%. The flat aggregate is mostly distributed tiled or vertically, resulting in displacement or spalling of adjacent aggregates, which is detrimental to the aggregate embedment and retention of chip seals. It is recommended that the flat aggregate content be kept below 10%. In addition, the mass loss of the chip seal after abrasion increases by approximately 2% when flat aggregate and elongated aggregate are both present. The percentage of aggregate embedding area is an ideal indicator for evaluating the performance of chip seals, as it combines good stability and sensitivity.
Key words:  chip seal  aggregate shape  embedding structure  spalling resistance  response surface methodology
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