| 摘要: |
| 为研究原竹保温材料界面的黏结应力与滑移分布，进行了12个试件的拉拔试验，研究了界面的破坏模式、黏结机理及影响黏结强度的因素，并给出了提高原竹保温材料界面黏结性能的措施.结果表明：原竹保温材料界面的黏结力由化学胶结力、机械咬合力及摩擦力3部分组成.原竹保温材料界面的滑移过程可分为4个阶段：无滑移阶段、滑移阶段、摩擦阶段、后滑移阶段.保温材料包裹原竹的长度越长、原竹表面越粗糙、原竹直径越小，其界面黏结强度越大，其中原竹表面粗糙度的影响最大.对原竹表面进行粗糙化处理、选用直径较小的原竹、用保温材料将原竹全面包裹可提高原竹保温材料界面的黏结性能. |
| 关键词: 保温材料 原竹 界面黏结滑移性能 拉拔试验 界面黏结机理 |
| DOI：103969/j.issn.1007 9629201801011 |
| 分类号: |
| 基金项目:国家重点研发计划项目（2017YFC0703502）；国家自然科学基金资助项目（51608433）；陕西省科技统筹创新工程计划项目（2016KTZDSF04 02 02）；住房和城乡建设部科学技术项目（2015 K2 003）；西部绿色建筑国家重点实验室培育基地开放基金资助项目（LSKF201801） |
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| Experimental Study on Bond Slip Behavior of Bamboo Thermal Insulation Material Interface |
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TIAN Limin1, HAO Jiping1, KOU Yuefeng1, XU Kun1, ZHAO Qiuli2
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1.School of Civil Engineering, Xian University of Architecture and Technology, Xian 710055, China;2.Guangzhou CRUPE Systems Building Materials Co., Ltd., Guangzhou 510070, China
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| Abstract: |
| In order to investigate the distribution of bonding stress and bond slip between bamboo and thermal insulation material interfacial, twelve specimens were made to perform the pull out test. The failure mode, bond mechanism and the influence factors of bond strength were analyzed. The results show that the bonding force between bamboo and thermal insulation material is composed by chemical bonding force, mechanical interaction and friction. Through establishing two typical bond slip curves, the failure process can be divided into four stages:no sliding segment, sliding segment, friction segment, after sliding segment. The more combined length between bamboo and thermal insulation material, the rougher of bamboo surface and the smaller of bamboo diameter, the greater the bond strength is. Thereinto, the influence of the roughness is the largest because it changes rule of bond strength. Some methods to enhance bond slip behavior of bamboo thermal insulation material interface is given:making the surface of bamboo rough, choosing the small diameter bamboo, and combining the thermal insulation material and bamboo completely. |
| Key words: thermal insulation material bamboo interfacial bond slip behavior pull out test interfacial bond mechanism |
