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引用本文:王茹,张腾飞,王培铭.废弃电路板非金属粉末粒径对水泥砂浆性能的影响[J].建筑材料学报,2013,(6):930-935
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废弃电路板非金属粉末粒径对水泥砂浆性能的影响
王茹, 张腾飞, 王培铭
同济大学先进土木工程材料教育部重点实验室,上海201804
摘要:
将废弃电路板回收处理后得到的非金属粉末掺入水泥砂浆中,研究非金属粉末粒径大小对水泥砂浆性能的影响;为改善非金属粉末和水泥浆体之间的界面性能进而改善复合砂浆的性能,采用硅烷偶联剂处理非金属粉末和在砂浆中加入丁苯乳液2种改性方法.结果表明:硅烷偶联剂处理可以降低砂浆的含气量和收缩率,加入丁苯乳液改善了砂浆的抗压强度和毛细孔吸水率.偶联剂处理和加入丁苯乳液都可以提高砂浆的抗折强度和黏结抗拉强度.废弃电路板非金属粉末粒径越小,水泥砂浆的抗压强度、抗折强度和黏结抗拉强度越大,含气量、收缩率和毛细孔吸水率越小.
关键词:  废弃电路板  非金属粉末  粒径  水泥砂浆  偶联剂  丁苯乳液  强度  收缩率  毛细孔吸水率
DOI:103969/j.issn1007 9629201306002
分类号:
基金项目:“十二五”国家科技支撑计划课题(2012BAJ20B02);国家自然科学基金资助项目(51202162);中央高校基本科研业务费专项资金资助项目(0500219146)
Effect of the Particle Size of Nonmetallic Powder Recycled fromWaste Printed Circuit Boards on the Performance of Cement Mortar
WANG Ru, ZHANG Teng fei, WANG Pei ming
Key Laboratory of Advanced Civil Engineering Materials of Ministry of Education, Tongji University, Shanghai201804, China
Abstract:
The nonmetallic powder recycled from waste printed circuit boards(PCBs) was used in cement mortar as an admixture. The effect of the particle size of nonmetallic powder on the performance of mortar was investigated. Styrene butadiene rubber(SBR) dispersion and coupling agent were used to improve the interface between nonmetallic powder and cement paste and thus the performance of mortar prepared with nonmetallic powder. The results show that the compressive strength, flexural strength and tensile bond strength increase as the particle size of nonmetallic powder decreases; and the air content, shrinkage rate and water capillary adsorption decline with the fall of the particle size of nonmetallic powder. The air content and shrinkage rate of mortar can be reduced by the treatment of coupling agent on the nonmetallic powder. Addition of styrene butadiene rubber dispersion improves the compressive strength and water capillary adsorption of mortar. Both treatment on the nonmetallic powder with coupling agent and addition of styrene butadiene rubber dispersion can enhance the flexural strength and tensile bond strength of mortar.
Key words:  waste printed circuit board  nonmetallic powder  particle size  cement mortar  coupling agent  styrene butadiene rubber dispersion  strength  shrinkage rate  water capillary adsorption
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